Q1: What are the main features of Toshiba Semiconductor TLP2160(TP,F)?
A: TLP2160(TP,F) is a dual-channel high-speed photocoupler with inverter logic and totem-pole output. It supports a 2.7 V to 5.5 V supply, 20 MBd data transfer rate, -40 to 125 degrees C operation, 2500 Vrms minimum isolation voltage, and plus or minus 20 kV per microsecond minimum common-mode transient immunity. It is housed in an 8-pin SO package and supports UL 1577, cUL, and EN 60747-5-5 safety standards.
Q2: What is TLP2160(TP,F) used for?
A: TLP2160(TP,F) is designed for high-speed isolated digital signal transmission. Typical applications include factory networking, communication interfaces, PLCs, measurement and instrumentation equipment, and high-speed digital interfaces for industrial control systems. Its dual-channel structure helps reduce board space while providing electrical isolation between circuits.
Q3: Does TLP2160(TP,F) have any alternative manufacturer and part number?
A: Toshiba currently lists TLP2261 as the recommended product for new designs. Toshiba describes it as having almost the same characteristics but a different package and switching speed, so it should not be considered a direct drop-in replacement without checking the complete circuit design. Other high-speed dual-channel logic-output optocouplers from manufacturers such as Broadcom, Renesas, and Vishay may also be evaluated, but compatibility must be verified for pinout, output configuration, supply voltage, propagation delay, isolation voltage, CMTI, package, and switching performance. TLP2160 is currently marked as not recommended for new designs.
Q4: Is technical support available for TLP2160(TP,F)?
A: Yes. Technical support can cover optocoupler selection, input LED drive current, totem-pole output operation, propagation delay, CMTI, isolation requirements, supply voltage, PCB layout, and replacement evaluation. Nantian Electronics can also provide TLP2160(TP,F) parameters, datasheet information, pin diagram instructions, quotation, and purchasing support.
