What are its key features?
High-speed DRAM memory IC, advanced process technology for improved performance and efficiency, high bandwidth data transfer capability, reliable operation, and compact 178-ball FBGA package suitable for high-density PCB designs.
What is it used for?
Used in applications that require fast and efficient memory access, such as networking equipment, embedded systems, industrial control, consumer electronics, and high-performance computing devices.
Are there alternative parts?
Yes, alternatives include similar DRAM memory devices from Samsung (other K4E series), Micron (MT41/MT40 series), SK hynix, and Nanya with comparable capacity, speed grade, and package type.
